Fang Chen
59Patents
11h-index
61Co-inventors
81Inventor score
Filing activity: Mar 5, 1998 → Nov 29, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6265317A | Top corner rounding for shallow trench isolation | Electricity | 130 | Expired |
| US6869868B2 | Method of fabricating a MOSFET device with metal containing gate structures | Electricity | 83 | Expired |
| US10333623B1 | Optical transceiver | Electricity | 69 | Active |
| US6001538A | Damage free passivation layer etching process | Electricity | 57 | Expired |
| US6174818A | Method of patterning narrow gate electrode | Electricity | 47 | Expired |
| US10797031B2 | Semiconductor package | Electricity | 36 | Active |
| US7122412B2 | Method of fabricating a necked FINFET device | Electricity | 23 | Expired |
| US6867084B1 | Gate structure and method of forming the gate dielectric with mini-spacer | Electricity | 18 | Expired |
| US10276554B1 | Integrated standard cell structure | Electricity | 13 | Active |
| US6051505A | Plasma etch method for forming metal-fluoropolymer residue free vias through silicon containing dielectric layers | Electricity | 13 | Expired |
| US10050042B2 | SRAM cell and logic cell design | Electricity | 11 | Active |
| US7511349B2 | Contact or via hole structure with enlarged bottom critical dimension | Electricity | 11 | Active |
| US6500727B1 | Silicon shallow trench etching with round top corner by photoresist-free process | Emerging Cross-Sectional Technologies | 10 | Expired |
| US9947657B2 | Semiconductor device and a method for fabricating the same | Electricity | 7 | Active |
| US9972571B1 | Logic cell structure and method | Electricity | 7 | Active |
| US6235440A | Method to control gate CD | Emerging Cross-Sectional Technologies | 7 | Expired |
| US9653594B2 | Semiconductor device and method for forming the same | Electricity | 6 | Active |
| US7306746B2 | Critical dimension control in a semiconductor fabrication process | Electricity | 5 | Expired |
| US10468418B2 | SRAM cell and logic cell design | Electricity | 5 | Active |
| US6828237B1 | Sidewall polymer deposition method for forming a patterned microelectronic layer | Electricity | 5 | Expired |
| US10529860B2 | Structure and method for FinFET device with contact over dielectric gate | Electricity | 4 | Active |
| US10914895B2 | Package structure and manufacturing method thereof | Electricity | 3 | Active |
| US10269797B2 | Semiconductor device and a method for fabricating the same | Electricity | 3 | Active |
| US9871046B2 | SRAM circuits with aligned gate electrodes | Electricity | 3 | Active |
| US10332896B2 | SRAM circuits with aligned gate electrodes | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.