Chip package and chip thereof
US10797213B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 29, 2019 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Jan 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microchip is electrically connected to a substrate to become a chip package, preferably for LED. A chip of the package includes a body and at least one electrode which is disposed and exposed on a surface of the body. The electrode includes a confining groove and a confining wall. The confining wall is peripherally located around the confining groove and provided to confine at least one conductive particle of an adhesive in the confining groove. The electrode of the chip is electrically connected to a bonding pad of a substrate via the conductive particle confined in the confining groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.