Cheng-Hung Shih
27Patents
3h-index
38Co-inventors
59Inventor score
Filing activity: Jan 6, 2011 → Jul 1, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8501614B1 | Method for manufacturing fine-pitch bumps and structure thereof | Electricity | 11 | Active |
| US8692390B2 | Pyramid bump structure | Electricity | 7 | Active |
| US8497579B1 | Semiconductor packaging method and structure thereof | Electricity | 4 | Active |
| US8530344B1 | Method for manufacturing fine-pitch bumps and structure thereof | Electricity | 3 | Active |
| US8916458B2 | III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same | Electricity | 1 | Active |
| US8450049B2 | Process for forming an anti-oxidant metal layer on an electronic device | Electricity | 1 | Active |
| US9508676B1 | Semiconductor package structure having hollow chamber and bottom substrate and package process thereof | Electricity | 1 | Active |
| US8581239B2 | Package structure and semiconductor structure thereof | Electricity | 1 | Active |
| US9312440B2 | Epitaxy structure of a light emitting element having III-nitride quantum wells | Electricity | 0 | Active |
| US12224734B2 | Surface acoustic wave device and method of manufacturing the same | Electricity | 0 | Active |
| US10144645B1 | Method for preparing spherical aluminum oxynitride powder | Chemistry; Metallurgy | 0 | Active |
| US10797213B2 | Chip package and chip thereof | Electricity | 0 | Active |
| US8877629B2 | Semiconductor manufacturing process and structure thereof | Electricity | 0 | Active |
| US11522517B2 | Surface acoustic wave device and method of manufacturing the same | Electricity | 0 | Active |
| US11056555B2 | Semiconductor device having 3D inductor and method of manufacturing the same | Electricity | 0 | Active |
| US8437142B2 | Bump structure and process of manufacturing the same | Electricity | 0 | Active |
| US10923621B2 | Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate | Electricity | 0 | Active |
| US11148864B1 | Storage container for electronic devices | Performing Operations; Transporting | 0 | Active |
| US9216906B2 | Method for manufacturing aluminum nitride powder | Chemistry; Metallurgy | 0 | Active |
| US8783897B2 | Lamp module with electronic connector adapter | Electricity | 0 | Active |
| US10381508B2 | Light emitting element with an enhanced electroluminescence effect | Electricity | 0 | Active |
| US10384941B2 | Method for producing spherical silicon nitride powder | Chemistry; Metallurgy | 0 | Active |
| US9147808B2 | III-nitride quantum well structure and a light-emitting unit using the same | Electricity | 0 | Active |
| US8330280B1 | Bump structure and process of manufacturing the same | Electricity | 0 | Active |
| US9230823B1 | Method of photoresist strip | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.