Heterogeneous thermal interface material for corner and or edge degradation mitigation
US10804181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2019 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Mar 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83862
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention relate to an heterogenous thermal interface material (TIM). The heterogenous TIM includes two or more different materials. One material has a low elastic modulus, also known as Young's modulus, and is utilized primarily to transfer heat from one component to another component. Another material has a higher elastic modulus and is primarily utilized to bond or connect the corners and/or edges of one component to the other component. The high elastic modulus material is generally located within the heterogenous TIM where TIM strain is or is expected to be high. For example, the high elastic modulus material may be located at the corner and/or edge regions of the heterogenous TIM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.