Marcus E. Interrante
11Patents
3h-index
32Co-inventors
52Inventor score
Filing activity: Jan 31, 2012 → Oct 3, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9401315B1 | Thermal hot spot cooling for semiconductor devices | Electricity | 11 | Active |
| US10541156B1 | Multi integrated circuit chip carrier package | Electricity | 8 | Active |
| US8444043B1 | Uniform solder reflow fixture | Electricity | 6 | Active |
| US9583408B1 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Electricity | 3 | Active |
| US9093563B2 | Electronic module assembly with patterned adhesive array | Electricity | 3 | Active |
| US10832987B2 | Managing thermal warpage of a laminate | Electricity | 0 | Active |
| US9224712B2 | 3D bond and assembly process for severely bowed interposer die | Electricity | 0 | Active |
| US9293439B2 | Electronic module assembly with patterned adhesive array | Electricity | 0 | Active |
| US11164804B2 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Electricity | 0 | Active |
| US10978314B2 | Multi integrated circuit chip carrier package | Electricity | 0 | Active |
| US10804181B2 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.