Printed wiring board
US10804191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2018 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Dec 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.