Hajime Sakamoto
40Patents
10h-index
24Co-inventors
71Inventor score
Filing activity: Jul 10, 2000 → Oct 11, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6586276B2 | Method for fabricating a microelectronic device using wafer-level adhesion layer deposition | Electricity | 86 | Expired |
| US6909054B2 | Multilayer printed wiring board and method for producing multilayer printed wiring board | Emerging Cross-Sectional Technologies | 70 | Expired |
| US7852634B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 46 | Active |
| US6889433B1 | Method of manufacturing printed-circuit board | Emerging Cross-Sectional Technologies | 44 | Expired |
| US7435910B2 | Multilayer printed circuit board | Emerging Cross-Sectional Technologies | 36 | Expired |
| US7842887B2 | Multilayer printed circuit board | Emerging Cross-Sectional Technologies | 24 | Active |
| US7855342B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7893360B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 12 | Active |
| US7888606B2 | Multilayer printed circuit board | Emerging Cross-Sectional Technologies | 12 | Active |
| US8079142B2 | Printed circuit board manufacturing method | Emerging Cross-Sectional Technologies | 10 | Active |
| US8453323B2 | Printed circuit board manufacturing method | Emerging Cross-Sectional Technologies | 10 | Active |
| US8186045B2 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Emerging Cross-Sectional Technologies | 7 | Active |
| US8067699B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 5 | Active |
| US9893016B2 | Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same | Electricity | 5 | Active |
| US7908745B2 | Method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 4 | Active |
| US7884286B2 | Multilayer printed circuit board | Emerging Cross-Sectional Technologies | 4 | Active |
| US8524535B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 3 | Active |
| US9245838B2 | Semiconductor element | Emerging Cross-Sectional Technologies | 3 | Active |
| US9711439B2 | Printed wiring board and method for manufacturing the same | Emerging Cross-Sectional Technologies | 3 | Active |
| US9706663B2 | Printed wiring board, method for manufacturing the same and semiconductor device | Emerging Cross-Sectional Technologies | 3 | Active |
| US7999387B2 | Semiconductor element connected to printed circuit board | Emerging Cross-Sectional Technologies | 3 | Active |
| US8058563B2 | Interposer and method for manufacturing interposer | Emerging Cross-Sectional Technologies | 2 | Active |
| US8293579B2 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US8959756B2 | Method of manufacturing a printed circuit board having an embedded electronic component | Emerging Cross-Sectional Technologies | 2 | Active |
| US8438727B2 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.