Semiconductor device having a boundary structure, a package on package structure, and a method of making
US10804234B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 12, 2019 |
| Grant date | Oct 13, 2020 |
| Priority date | — |
| Expiry date | Apr 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure, in some embodiments, relates to a semiconductor structure. The semiconductor structure includes a substrate and a first conductive pad arranged over the substrate. A boundary structure is on an upper surface of the substrate around the first conductive pad. The boundary structure has one or more sidewalls defining an opening with a round shape over the first conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.