Laser processing apparatus
US10807198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2018 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Jan 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laser processing apparatus includes: a chuck table that holds a packaged wafer by a holding surface; a laser processing unit that applies a laser beam to the packaged wafer to form a through-groove along each division line; an X-axis moving unit that moves the chuck table in an X-axis direction; and an examination unit. The chuck table includes: a holding member that forms the holding surface; and a light emitting body. The examination unit includes: a line sensor that extends in a Y-axis direction; and a control unit that determines the result of processing through reception by the line sensor of light from the light emitting body through the through-groove. The line sensor images the whole surface of the packaged wafer being held by the chuck table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.