Magnetic anode for sputter magnetron cathode
US10811236B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Oct 26, 2015 |
| Grant date | Oct 20, 2020 |
| Priority date | — |
| Expiry date | Oct 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3452
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A rotary sputter magnetron assembly for use in sputtering target material onto a substrate is provided. The assembly comprises a longitudinally extending target tube having a longitudinal central axis, said target tube extending about a magnet array that is configured to generate a plasma confining magnetic field adjacent the target tube, said target tube supported for rotation about its longitudinal central axis and a pair of side shunts positioned parallel to the longitudinal central axis, and on opposing lengthwise sides of said target tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.