Patent · US Active

Semiconductor package and method of manufacturing a semiconductor package

US10811342B2 · kind B2 · utility

0Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Sergey Yuferev · Villach, AT
Robert Fehler · Regensburg, DE
Petteri Palm · Regensburg, DE

Key dates

Filing date	Feb 27, 2019
Grant date	Oct 20, 2020
Priority date	—
Expiry date	Feb 27, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor die having a semiconductor device, and first and second contact pads arranged on opposite surfaces of the die. The semiconductor die is embedded in a dielectric layer. The semiconductor package also includes one or more first package contact pads and one or more second package contact pads arranged on a first major surface of the semiconductor package. The first contact pad of the die is coupled to the one or more first package contact pads, and the second contact pad of the die is coupled to the one or more second package contact pads. In operation, the semiconductor device causes a current path between the first contact pad and the second contact pad. The package contact pads are arranged on the first major surface of the semiconductor package to provide multiple non-parallel current paths.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.