Robert Fehler
13Patents
1h-index
18Co-inventors
43Inventor score
Filing activity: Jun 21, 2018 → Nov 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11469164B2 | Space efficient and low parasitic half bridge | Electricity | 1 | Active |
| US11444017B2 | Semiconductor package and method of manufacturing a semiconductor package | Electricity | 0 | Active |
| US10811342B2 | Semiconductor package and method of manufacturing a semiconductor package | Electricity | 0 | Active |
| US12131988B2 | Semiconductor package and passive element with interposer | Electricity | 0 | Active |
| US12159829B2 | Semiconductor package with non-uniformly distributed vias | Electricity | 0 | Active |
| US12009290B2 | Semiconductor module having a multi-branch switch node connector | Electricity | 0 | Active |
| US11935874B2 | Circuitry and method of forming a circuitry | Electricity | 0 | Active |
| US11348861B2 | Semiconductor package and method of manufacturing a semiconductor package | Electricity | 0 | Active |
| US11664304B2 | Semiconductor module | Electricity | 0 | Active |
| US12237246B2 | Semiconductor devices including parallel electrically conductive layers | Electricity | 0 | Active |
| US12431367B2 | Embedded package with shielding pad | Electricity | 0 | Active |
| US10916484B2 | Electronic device including redistribution layer pad having a void | Electricity | 0 | Active |
| US11848262B2 | Semiconductor package and passive element with interposer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.