Patent · US Active

Arrangement

US10811582B2 · kind B2 · utility

0Cited by

5References

13Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Andreas Loeffler · Neutraubling, DE
Thomas Hager · Easton, US
Christoph Walter · Regensburg, DE
Alfred Lell · Maxhütte-Haidhof, DE

Key dates

Filing date	Jun 15, 2016
Grant date	Oct 20, 2020
Priority date	—
Expiry date	Jun 15, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/855
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An arrangement is disclosed. In an embodiment the arrangement includes at least one semiconductor component and a heat sink, wherein the semiconductor component is arranged on the heat sink, wherein the heat sink is configured to dissipate heat from the semiconductor component, wherein the heat sink comprises a thermally conductive material, and wherein the material comprises at least aluminum and silicon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.