Package structure of optical apparatus
US10816692B2 · kind B2 · utility
0Cited by
13References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.