Patent · US Active

Package structure and method for fabricating the same

US10818609B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Harry-Hak-Lay Chuang · Austin, US
Chia-Hsiang Chen · Sunnyvale, US
Meng-Chun Shih · Hsinchu, TW
Ching-Huang Wang · Taipei, TW
Tien-Wei Chiang · Taipei, TW

Key dates

Filing date	Jul 13, 2018
Grant date	Oct 27, 2020
Priority date	—
Expiry date	Jul 13, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10B61/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure provides a package structure, including a semiconductor chip having a magnetic device, wherein the semiconductor chip includes a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface, and a first magnetic field shielding at least partially surrounding the third surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.