Rigid pickup head with conformable layer
US10818643B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2020 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | Jan 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to using a pickup assembly to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. An LED assembly system places LEDs on a temporary substrate after fabrication. Pickup heads of the pickup assembly are coated with a conformable material to enable attachment of each LED to a pickup head. The pickup head removes the LEDs away from the temporary substrate and aligns the LEDs onto a target substrate. The LED assembly system provides heat to an electrode of the LEDs and a corresponding electrical contact pad of the target substrate. The pickup assembly applies force to the LED on the target substrate, such that with the heat, the electrode of the LED and the electrical contact pad are bonded. The pickup assembly releases the LED onto the target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.