Manufacturing method for circuit board and circuit board thereof
US10820411B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2020 |
| Grant date | Oct 27, 2020 |
| Priority date | — |
| Expiry date | May 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a circuit board and a circuit board are provided. The method includes steps: providing a substrate having a first metal layer; forming a patterned first opening on the first metal layer to expose the substrate; forming a patterned first dielectric layer on the substrate, the first dielectric layer is made of a photosensitive dielectric material and covers the first opening; photosensitizing the first dielectric layer to cure the first dielectric layer; forming a patterned second metal layer on the first metal layer; forming a patterned third metal layer on the second metal layer, and the third metal layer being adjacent to the first dielectric layer; removing a portion of the first metal layer not covered by the second metal layer; and forming a second dielectric layer on the substrate. A thickness of the third metal layer is greater than a thickness of the second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.