Patent · US Active

Photonics package integration

US10823921B2 · kind B2 · utility

5Cited by
2References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 21, 2019
Grant dateNov 3, 2020
Priority date—
Expiry dateFeb 21, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L25/167
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An interconnect package integrates a photonic die, an electronic die, and a switch ASIC into one package. At least some of the components in the electronic die, such as, for example, the serializer/deserializer circuits, transceivers, clocking circuitry, and/or control circuitry are integrated into the switch ASIC to produce an integrated switch ASIC. The photonic die is attached and electrically connected to the integrated switch ASIC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.