Carrier structure
US10825599B2 · kind B2 · utility
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9Claims
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Assignee
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Key dates
| Filing date | Nov 21, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Sep 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09272
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.