System and method for reduced workpiece adhesion due to electrostatic charge during removal from a processing station
US10825645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Feb 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/24564
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for reduced workpiece adhesion during removal from a semiconductor processing station. The system provides an electrostatic charge detector that measures the residual charge on an electrostatically clamped workpiece prior to removal from a processing station inside the semiconductor processing tool. One embodiment uses an algorithm that to predict when to remove the workpiece without electrostatic adhesion based upon the decay rate of the residual electrostatic charge (Q) on the workpiece. Other embodiments also provide for a processing station static charge buildup health check and an excessive static charge check on incoming workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.