Plasma processing apparatus
US10825657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Apr 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus with improved yield, adapted to include a vacuum container, a processing chamber disposed inside thereof, and in which a plasma is formed, a sample table disposed in the processing chamber and on which a sample is placed, two electrodes which have a film shape, disposed within the sample table, and to which power for attracting the sample is supplied so that different polarities are formed, a coiled portion in which two power supply lines are wound in parallel around the same axis, and a bypass line which connects the two power supply lines between the coiled portion and the two electrodes and has a capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.