Stretching retention plate for electronic assemblies
US10825714B2 · kind B2 · utility
0Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2016 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7598
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.