Patent · US Active

Semiconductor device and method with clip arrangement in IC package

US10825757B2 · kind B2 · utility

1Cited by

7References

16Claims

0Family size

Assignee

Nexperia B.V. · NL

Inventors

Haibo Fan · Woodbridge, US
Pompeo V. Umali · Kwai Chung, CN
Tim Boettcher · Scheeßel, DE
Wai Wong Chow · Sai Kung, CN

Key dates

Filing date	Dec 19, 2016
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Dec 19, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various example embodiments concern an integrated circuit (IC) package having a clip with a protruding tough-shaped finger portion. The clip can be used in various IC packages including, for example, soft-soldered compact power packages such as rectifiers with specified surge current capability. Such embodiments can be implemented to allow for a visual inspection capability of the soldering area for connecting a lead frame, via the clip, to a surface of the IC package die, while still providing sufficient thermal mass to limit the temperature increase during forward surge current loads. This results in a simple to manufacture design without compromising too much on performance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.