Tim Boettcher
12Patents
2h-index
25Co-inventors
46Inventor score
Filing activity: May 8, 2013 → Dec 17, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9418918B2 | Lead for connection to a semiconductor device | Electricity | 4 | Active |
| US9911816B2 | Semiconductive device and associated method of manufacture | Electricity | 2 | Active |
| US10825757B2 | Semiconductor device and method with clip arrangement in IC package | Electricity | 1 | Active |
| US9461183B2 | Diode having a reduced surface field effect trench structure and method of manufacturing a diode having a reduced surface field effect trench structure | Electricity | 1 | Active |
| US9735290B2 | Semiconductor device | Electricity | 0 | Active |
| US8981566B2 | Discrete semiconductor device package and manufacturing method | Electricity | 0 | Active |
| US10056459B2 | Semiconductor arrangement | Electricity | 0 | Active |
| US9064847B2 | Heterojunction semiconductor device with conductive barrier portion and manufacturing method | Electricity | 0 | Active |
| US10586861B2 | Semiconductor device | Electricity | 0 | Active |
| US10658274B2 | Electronic device | Electricity | 0 | Active |
| US9349819B2 | Heterojunction semiconductor device and manufacturing method | Electricity | 0 | Active |
| US9263335B2 | Discrete semiconductor device package and manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.