Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
US10826147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2018 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Jan 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09854
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.