Power chip and bridge circuit
US10826483B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Aug 18, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power chip and a bridge circuit are disclosed in the present disclosure. The power chip includes a metal region and a wafer region, wherein the power chip further includes: a first power switch, formed in the wafer region; and a second power switch, formed in the wafer region, wherein the first and second power switches constitute an upper bridge arm and a lower bridge arm of a bridge circuit, respectively. At least one of the upper bridge arm and the lower bridge arm includes two or more power switches which are connected in parallel with each other, and the first and second power switches are arranged alternatively along at least one dimension direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.