Patent · US Active

Printed circuit board with cavity

US10827617B2 · kind B2 · utility

1Cited by

0References

20Claims

0Family size

Assignee

Avago Technologies International Sales Pte. Limited · SG

Inventors

Dingyou Zhang · Ballston Lake, US
Nitesh Kumbhat · San Jose, US
Li Sun · San Jose, US
Sarah Haney · San Jose, US
Chang Kyu Choi · Seongnam-si, KR

Key dates

Filing date	Jan 29, 2019
Grant date	Nov 3, 2020
Priority date	—
Expiry date	Feb 17, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10734
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.