Printed circuit board and method for manufacturing printed circuit board
US10827619B2 · kind B2 · utility
0Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Dec 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0307
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a printed circuit board embedding a power die wherein interconnections between the power die and the printed circuit board are composed of micro/nano wires, the printed circuit board comprising a cavity wherein the power die is placed, and wherein the cavity is further filled with a dielectric fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.