Polishing pad and polishing method
US10828745B2 · kind B2 · utility
0Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Oct 17, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.