Tin-plated product and method for producing same
US10829862B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F1/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.