Substrate processing apparatus and substrate processing method
US10832902B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2016 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Jun 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus including: a holding unit that holds a substrate; a processing liquid supply unit that supplies a processing liquid to the substrate; a cup that includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, and surrounds the holding unit; and a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the peripheral wall portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.