Dry-etching of carrier substrate for microLED microassembly
US10832933B1 · kind B1 · utility
1Cited by
1References
17Claims
0Family size
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Key dates
| Filing date | Apr 2, 2018 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Apr 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of placing light emitting diodes (LEDs) includes embedding an array of LEDs in a polymer layer on a substrate. The method includes detaching at least one LED in the array of LEDs from the substrate by dry-etching the polymer layer in which at least one LED is embedded. A pick-up-tool (PUT) is brought into contact with at least one surface of at least one LED facing away from the substrate, responsive to dry-etching the polymer layer. The PUT is lifted with the at least one LED attached to the PUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.