Patent · US Active

Interconnect for electronic device

US10833036B2 · kind B2 · utility

0Cited by

10References

18Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Patrick Francis Thompson · Allen, US
Christopher Daniel Manack · Flower Mound, US
Stefan Herzer · Marzling, DE
Rakshit Agrawal · Lewisville, US

Key dates

Filing date	Dec 27, 2018
Grant date	Nov 10, 2020
Priority date	—
Expiry date	Dec 27, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16245
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.