Thin film solid-state microbattery packaging
US10833296B2 · kind B2 · utility
1Cited by
2References
6Claims
0Family size
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Key dates
| Filing date | Sep 26, 2017 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | May 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.