High-speed connector on high-density mini version chip side
US10833437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2019 |
| Grant date | Nov 10, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2428
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a high-speed connector on a high density MINI version chip side, which comprises a board end connector, a wire end connector and a printed circuit board; the board end connector is arranged on the printed circuit board; the board end connector comprises a board end connector shell and a board end connector body arranged in the board end connector shell; the wire end connector comprises a wire end case and a tongue plate fixed to the wire end case; wherein at least one guide piece is extended from the board end connector shell, and the wire end case is provided with at least one guide slot for creating a butt joint with the guide piece. The connector of the present invention utilizes the space of the board end to the maximum extent, solves the problem that the CPU occupies the space of the board end due to the increased size of the heat dissipation module, and can realize high-speed data transmission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.