Patent · US Active

Methods of manufacturing inductor modules and power semiconductor systems having inductor modules

US10833583B2 · kind B2 · utility

0Cited by

4References

18Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Petteri Palm · Regensburg, DE
Frank Daeche · Unterhaching, DE
Zeeshan Umar · Munich, DE
Andrew N. Sawle · Petworth, GB
Maciej Wojnowski · Munich, DE
Xaver Schloegel · Sachsenkam, DE
Josef Hoeglauer · Munich, DE

Key dates

Filing date	Mar 6, 2020
Grant date	Nov 10, 2020
Priority date	—
Expiry date	Mar 6, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a power semiconductor system includes providing a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board and attaching an inductor module to the power stage module such that the inductor module is electrically connected to an output node of the power stage module. The inductor module includes a ferrite sheet embedded in a second printed circuit board and windings patterned into the second printed circuit board. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.