Inventor · Unterhaching, DE

Frank Daeche

24Patents
5h-index
34Co-inventors
69Inventor score

Filing activity: Sep 30, 2002 → Mar 17, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7268436B2 Electronic device with cavity and a method for producing the same Electricity 106 Expired
US7031170B2 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device Emerging Cross-Sectional Technologies 60 Expired
US7221048B2 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier Electricity 15 Expired
US7011986B2 Method for manufacturing a housing for a chip with a micromechanical structure Electricity 8 Expired
US9773719B2 Semiconductor packages and methods of fabrication thereof Electricity 5 Active
US8686569B2 Die arrangement and method of forming a die arrangement Electricity 2 Active
US10186481B2 Semiconductor device including a passive component formed in a redistribution layer Electricity 1 Active
US9059155B2 Chip package and method for manufacturing the same Electricity 1 Active
US9425116B2 Integrated circuit package and a method for manufacturing an integrated circuit package Electricity 1 Active
US11562967B2 Method for fabricating a semiconductor package, semiconductor package and embedded PCB module Electricity 0 Active
US9269685B2 Integrated circuit package and packaging methods Electricity 0 Active
US11539291B2 Method of manufacturing a power semiconductor system Emerging Cross-Sectional Technologies 0 Active
US10833583B2 Methods of manufacturing inductor modules and power semiconductor systems having inductor modules Emerging Cross-Sectional Technologies 0 Active
US9236362B2 Integrated circuit package and packaging methods General 0 Revoked
US11996771B2 Power semiconductor system having an inductor module attached to a power stage module Emerging Cross-Sectional Technologies 0 Active
US11004823B2 Chip assembly and method of manufacturing thereof Electricity 0 Active
US11183445B2 Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement Electricity 0 Active
US9105562B2 Integrated circuit package and packaging methods Electricity 0 Active
US10601314B2 Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules Emerging Cross-Sectional Technologies 0 Active
US10325834B2 Semiconductor packages and methods of fabrication thereof Electricity 0 Active
US9437548B2 Chip package and method for manufacturing the same Electricity 0 Active
US11632860B2 Power electronic assembly and method of producing thereof Electricity 0 Active
US11903132B2 Power electronic assembly having a laminate inlay and method of producing the power electronic assembly Electricity 0 Active
US11699640B2 Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.