Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure
US10836631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Aug 27, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is described for closing off a micromechanical device by laser melting, having the steps: (A) providing a micromechanical device having an access channel that has a collar at an external opening; (B) closing off the external opening of the access channel by laser irradiation of the collar, the collar being at least partly melted and the external opening being closed with melt made of a material of the collar. Also described is a micromechanical device having a laser melt closure, in particular produced by the method according to the present invention, the micromechanical device having an access channel that has a collar at an external opening, the external opening of the access channel being closed by a melt closure made of a material of the collar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.