Plasma spreading apparatus and method of spreading plasma in process ovens
US10840068B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/335
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device and method of spreading plasma which allows for plasma etching over a larger range of process chamber pressures. A plasma source, such as a linear inductive plasma source, may be choked to alter back pressure within the plasma source. The plasma may then be spread around a deflecting disc which spreads the plasma under a dome which then allows for very even plasma etch rates across the surface of a substrate. The apparatus may include a linear inductive plasma source above a plasma spreading portion which spreads plasma across a horizontally configured wafer or other substrate. The substrate support may include heating elements adapted to enhance the etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.