Substrate processing apparatus, substrate processing method and storage medium
US10840079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2017 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Jan 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.