Temporary bonding layer for flexible electronics fabrication
US10840120B2 · kind B2 · utility
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Key dates
| Filing date | Nov 27, 2017 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Nov 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68395
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.