Workpiece-separating device and workpiece-separating method
US10840141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Jun 12, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.