Shin-Etsu Engineering Co., Ltd.
9Patents
6Active
9Granted
40Portfolio score
Filing activity: Apr 2, 1982 → Aug 23, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4433510A | Method for controlling thickness of wafer-like work pieces under lapping and a lapping machine therefor | Physics | 29 | Expired |
| US4731745A | Automatic dimension analyzer | Physics | 14 | Expired |
| US6437304B1 | Steam generator | Mechanical Engineering; Lighting; Heating | 4 | Expired |
| US10840141B2 | Workpiece-separating device and workpiece-separating method | Performing Operations; Transporting | 1 | Active |
| US11633810B2 | Workpiece-separating device and workpiece-separating method | Performing Operations; Transporting | 0 | Active |
| US10293460B2 | Method of producing polishing head and polishing apparatus | Performing Operations; Transporting | 0 | Active |
| US11322384B2 | Substrate processing apparatus and substrate processing method | Electricity | 0 | Active |
| US11251058B1 | Workpiece-separating device and workpiece-separating method | Electricity | 0 | Active |
| US11654513B2 | Workpiece-separating device and workpiece-separating method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.