Electronics package with improved thermal performance
US10840165B2 · kind B2 · utility
0Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2019 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Apr 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.