Jonathan J. Fain
4Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Apr 28, 2016 → Apr 24, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9799637B2 | Semiconductor package with lid having lid conductive structure | Electricity | 1 | Active |
| US10325828B2 | Electronics package with improved thermal performance | Electricity | 0 | Active |
| US10840165B2 | Electronics package with improved thermal performance | Electricity | 0 | Active |
| US10008473B2 | Power package lid | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.