Patent · US Active

Interposer with flexible portion

US10840177B2 · kind B2 · utility

1Cited by

0References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Tin Poay Chuah · Bukit Mertajam, MY

Key dates

Filing date	May 28, 2019
Grant date	Nov 17, 2020
Priority date	—
Expiry date	May 28, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10378
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer with a flexible portion. A first portion of the interposer can electrically connect to a top side of a motherboard. A flexible portion of the interposer, adjacent to the first portion, can wrap around an edge of the motherboard. A peripheral portion of the interposer, adjacent to the flexible portion, can electrically connect to a bottom side of the motherboard. The peripheral portion can be flexible or rigid. The interposer can define a cavity that extends through the first portion of the interposer. A chip package can electrically connect to the first portion of the interposer. The chip package can be coupled to at least one electrical component that extends into the cavity when the chip package is connected to the interposer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.