Electronic devices with bond pads formed on a molybdenum layer
US10840179B2 · kind B2 · utility
2Cited by
6References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Feb 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3656
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprises: a molybdenum layer; a bond pad formed on the molybdenum layer, the bond pad comprising aluminum; and a wire bonded to the bond pad, the wire comprising gold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.