Carrier and integrated memory

US10840214B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Charles L. Arvin · Savannah, US
• Brian M. Erwin · Lagrangeville, US
• Mark W. Kapfhammer · Fishkill, US
• Brian W. Quinlan · Poughkeepsie, US
• Charles L. Reynolds · Red Hook, US
• Thomas Weiss · Poughkeepsie, US

Key dates

• Filing date: Aug 21, 2019
• Grant date: Nov 17, 2020
• Expiry date: Aug 21, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3511
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit (IC) chip carrier includes one or more memory devices therein. The memory is integrated into the carrier prior to the IC chip being connected to the carrier. Therefore, the IC chip may be connected to the memory at the same time as the IC chip is connected to the carrier. An access instruction may be sent from the IC chip to the memory through a wiring line of the IC chip carrier. Power potential may be sent from a system board to the memory through a vertical interconnect access (VIA). Alternatively, an access instruction may be sent from a first IC chip to the memory and power potential may be sent from a second IC chip to the memory.