Electronic package
US10840581B2 · kind B2 · utility
0Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Nov 17, 2020 |
| Priority date | — |
| Expiry date | Apr 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15321
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.