Semiconductor wafer made of monocrystalline silicon, and method for producing same
US10844515B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2016 |
| Grant date | Nov 24, 2020 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2006/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer comprising single-crystal silicon has defined concentrations of oxygen, nitrogen and hydrogen; the semiconductor wafer further contains BMD seeds having a density averaged over the radius of not less than 1×105 cm−3 and not more than 1×107 cm−3; surface defects having a density averaged over the radius of not less than 1100 cm−2; and BMDs, whose density is not lower than a lower limit of 5×108/cm3. The semiconductor wafers are produced by a process which enables obtention of the required ranges of concentrations of oxygen, nitrogen, hydrogen, BMD seeds, and BMD's.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.